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Shenzhen SYF Precision Electronics limited company
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Multi Layer DIP CSP Printed Circuit Board Assemblies For MP4 0.3 mm Thickness
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Multi Layer DIP CSP Printed Circuit Bo
Multi Layer DIP CSP Printed Circuit Board AssembliesFor MP4 0.3 mm Thickness
Characteristics:
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service.
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Key Specifications/Special Features |
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1 |
We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed. |
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All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts. |
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3 |
We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging. |
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SMT/SMD assembly and through-hole components insertion |
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IC preprogramming |
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Function verification and burn in testing |
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Complete unit assembly (which including plastics, metal box, coil, cable inside and more) |
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Environmental coating |
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Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure |
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Packaging design and production of customized PCBA |
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100% quality assurance |
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High mixed, low volume order is also welcomed. |
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Full component procurement or the substitute components sourcing |
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UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant |
3.PCB Assembly process capability
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PRODUCTION CAPABILITY OF PCB ASSEMBLY |
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Stencil Size Range |
756 mm x 756 mm |
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Min. IC Pitch |
0.30 mm |
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Max. PCB Size |
560 mm x 650 mm |
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Min. PCB Thickness |
0.30 mm |
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Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
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Max. BGA Size |
74 mm X 74 mm |
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BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
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BGA Bal
Shenzhen SYF Precision Electronics limited company [China (Mainland)]
Business Type:Manufacturer | ||
