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Shenzhen SYF Precision Electronics limited company
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TACONIC HDI Multi Layer PCB Impedance Control And Buried Via 0.25mm Hole Size
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
TACONIC HDI Multi Layer PCB Impedance
TACONIC HDI Multi Layer PCB Impedance Control And Buried Via 0.25mm Hole Size
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PRODUCT’S DETAILS |
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Raw Material |
FR-4 (Tg 180 available) |
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Layer Count |
4-Layer |
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Board Thickness |
1.6mm |
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Copper Thickness |
1.0oz |
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Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
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Solder Mask |
Green |
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Silkscreen |
White |
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Min. Trace Width/Spacing |
0.075/0.075mm |
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Min. Hole Size |
0.25mm |
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Hole Wall Copper Thickness |
≥20μm |
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Measurement |
300×400mm |
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Packaging |
Inner: Vacuum-packed in soft plastic bales |
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Application |
Communication,automobile,cell,computer,medical |
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Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
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ITEMS Item |
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Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
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Thickness |
0.23.2mm |
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Production Type |
Layer Count |
2L-16L |
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Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, |
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Cut Lamination |
Max. Working Panel size |
1000×1200mm |
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Shenzhen SYF Precision Electronics limited company [China (Mainland)]
Business Type:Manufacturer | ||
